Name: ICD970
Brand: DFI

US Store

ICD970

產品概要

首頁嵌入式電腦模組 COM Express Basic ICD970

3rd Gen Intel® Xeon® Processor D-1700 Family

Default 2 260-pin DDR4 2666 SO-DIMM, dual channel mode up to 64GB, 3rd DIMM by request(SDPC mode by request to support DDR4 2933MHz)

Support extended operating temperature: -40 to 85°C

10GBASE-KR: Support up to 4 x 10GbE Mac ports

Multiple Expansion: 1 PCIe x16 (Gen4), 2 PCIe x8 (Gen3), 1 SMBus, 1 I2C, 1 LPC, 2 UART (TX/RX)

Rich I/O: 2 Intel GbE, 4 USB 3.0, 4 USB 2.0, 2 SATA 3.0

15-Year CPU Life Cycle Support Until Q1' 37 (Based on Intel IOTG Roadmap)

狀態 : 上市產品前往詢價

+加入比較表 +加入詢價表

產品比較
目前共有 0 樣產品可同時比較三款產品
前往比較

加入詢價表
目前共有 0 樣產品可同時詢價三款產品
前往詢價

系統

處理器

3rd Gen Intel® Xeon® Scalable Processors D-1700 Family
Intel® Xeon® D-1746TER Processor, 10 Cores, 15MB Cache, 2.0GHz, 67W
Intel® Xeon® D-1735TR Processor, 8 Cores, 15MB Cache, 2.2GHz, 59W
Intel® Xeon® D-1732TE Processor, 8 Cores, 15MB Cache, 1.9GHz, 52W
Intel® Xeon® D-1715TER Processor, 4 Cores, 10MB Cache, 2.4GHz, 50W
Intel® Xeon® D-1712TR Processor, 4 Cores, 10MB Cache, 2.0GHz, 40W

記憶體

Default 2 260-pin DDR4 2666 SO-DIMM, dual channel mode up to 64GB
3rd DIMM by request
(SDPC mode by request to support DDR4 2933MHz)

BIOS

Insyde SPI 512Mbit

擴充

介面

Default:
B1: 1 x PCIe x8 or 2 x PCIe x4 or 4x PCIe x2 (Gen 3)
B2: 1 x PCIe x8 or 2 x PCIe x4 or 4x PCIe x2 (Gen 3)
B3/B4: 1 x PCIe x16 or 2 x PCIe x8 or 4x PCIe x4 (Gen 4)
1 x LPC
1 x I2C
1 x SMBus
2 x UART (TX/RX)

乙太網路

控制器

Supports up to 4 x 10GBASE-KR interfaces and max up to 4 x 10GbE MAC ports (maximum bandwidth 40Gb by activating the 4 x 10GbE at the same time)
1 x Intel® I210AT (10/100/1000Mbps) (0 to 60°C) or
1 x Intel® I210IT (10/100/1000Mbps) (-40 to 85°C)

輸入/輸出

USB

4 x USB 3.0
4 x USB 2.0

SATA

2 x SATA 3.0 (up to 6Gb/s)

DIO

1 x 8-bit DIO (4 in, 4 out)

監視計時器

輸出與時間間隔

System Reset, Programmable via Software from 1 to 255 Seconds

安全性

信賴平臺模組

Default TPM2.0, fTPM by request

電源

類型

12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)

耗能

Typical: 71.36W
Max: 72.36W

支援作業系統

微軟

Windows Server 2019, 2022

Linux

Ubuntu 20.04, CentOS 7.5

環境指標

溫度

Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C

濕度

Operating: 5 to 90% RH
Storage: 5 to 90% RH

MTBF

277,731hrs @25°C; 144,676hrs @45°C; 81,589hrs @60°C; 55,811hrs @70°C; 37,526 @85°C
Calculation model: Telcordia Issue 4
Environment: GB, GC – Ground Benign, Controlled

機械結構

尺寸

COM Express® Basic
95mm (3.74") x 125mm (4.9")

規範

PICMG COM Express® R3.0, Type 7

安規認證

認證

CE, FCC, RoHS

裝箱單

1 ICD970 board
1 Cooler (Height: 47.80 mm) 0 to 60°C: TBD / -40 to 85°C: TBD

Country of Origin

台灣

ICD970｜Intel®｜嵌入式電腦模組｜友通資訊 DFI

ICD970 產品概要

3rd Gen Intel® Xeon® Processor D-1700 Family

Default 2 260-pin DDR4 2666 SO-DIMM, dual channel mode up to 64GB, 3rd DIMM by request(SDPC mode by request to support DDR4 2933MHz)

Support extended operating temperature: -40 to 85°C

10GBASE-KR: Support up to 4 x 10GbE Mac ports

Multiple Expansion: 1 PCIe x16 (Gen4), 2 PCIe x8 (Gen3), 1 SMBus, 1 I2C, 1 LPC, 2 UART (TX/RX)

Rich I/O: 2 Intel GbE, 4 USB 3.0, 4 USB 2.0, 2 SATA 3.0

15-Year CPU Life Cycle Support Until Q1' 37 (Based on Intel IOTG Roadmap)

ICD970 Feature

寬溫: -40~85°C

PCIe x16擴充插槽

修正錯誤記憶體

多元擴充插槽

10Gb乙太網路

DDR4記憶體

ICD970 認證書

RoHS 認證

CE 認證

FCC 認證

ICD970 相關標籤

Edge AI Computing

Slim Bootloader

IoT

Intel

5G

無風扇設計

PCIe x16擴充插槽

Windows

Linux

多元擴充插槽

10Gb乙太網路

DDR4記憶體

RoHS認證

CE認證

FCC認證

高效能

醫療

Intel® 第三代 Xeon Ice Lake-SP 處理器

ICD970 相關資源

ICD970 相關產品

DV970

與友通合作

相關資源

相關產品