Name: ECX700-ADP
Brand: DFI

US Store

ECX700-ADP

产品概要

首页工业级系统加固嵌入式系统 ECX700-ADP

Intel® Alder Lake-P Processor i5-1245UE/ i7-1265UE

Intel® Iris® Xe Graphic Performance

Extreme Ruggedized design to IEC 60068-2-64 & -20 ~ 70°C wide temperature

Rich I/O help integrators meet the demand for various applications

To fulfill wireless transmission, an external SIM slot reduces the difficulties to change SIMs, and the high gain antenna ensures the quality of the signal

Various applications: Industrial automation, Outdoor application

Waterproof & Dustproof design conforming to IP67

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ECX700-ADP 嵌入式系统解决方案采用：

ADP253

4" SBC, 12th Gen Intel® Core™ Processors, On-board...

系统

处理器

12th Gen Intel® Core™ Processors, BGA 1744 (Alder Lake-P, 15W)
Intel® Core™ i7-1265UE Processor, 10C12T, 12M Cache, 1.7GHz (4.7GHz)
Intel® Core™ i5-1245UE Processor, 10C12T, 12M Cache, 1.5GHz (4.4GHz)

内存

8GB On-board memory & one SO-DIMM DDR4 up to 32GB
Dual Channel DDR4 3200MHz

BIOS

AMI SPI 256Mbit

显示

控制器

Intel® Iris® Xe Graphics eligible

特性

OpenGL 4.2, Direct X 11.1, OpenCL 1.2, OGL ES 3.0
HW Decode: H.264, MPEG2, VC1, VP8, H.265, MPEG4, MVC, VP9, WMV9, JPEG/MJPEG
HW Encode: H.264, MPEG4, VP8, H.265, MVC

显示器

1 x HDMI
HDMI: resolution up to 3840x2160@30Hz

储存

M.2 SSD (M Key)

256GB Available(128GB/512GB by project support)

扩充

界面

1 x M.2 3042/3052 B key (PCIe x1 & USB3.0/2.0)(for LTE or 5G module)
1 x M.2 2230 E Key (PCIe x1 & USB2.0)(for Wi-Fi module)

以太网路

控制器

2 x Intel® i225IT (10/100/1000Mbps)

LED

指示灯

1 x Power Status LED

侧面输入/输出

显示器

1 x HDMI

SIM

1 x SIM card slot

USB

2 x USB 3.2

上板输入/输出

天线孔

6 x Antenna (2 x WiFi, 4 x LTE)

底板输入/输出

以太网络

2 x GbE

USB

2 x USB 3.2

集合连接器

2 x RS232 and 2 x Can bus protocol

电源

1 x 9~36V DC-IN

Vent

1 x Vent

监视定时器

看门狗定时器

System Reset, Programmable via Software from 1 to 255 Seconds

电源

类型

DC-in 9~36V

端口

M12 D-code

支持操作系统

微软

Windows 10 IoT Enterprise 64-bit
Windows 11 IoT Enterprise LTSC 2024

Linux

环境指标

运作温度

-20 to 70°C

储存温度

-40 to 85°C

相对湿度

5 to 95% RH (non-condensing)

机械结构

安装方式

Wall mount

尺寸 (宽 x 高 x 深)

239.24 x 194 x 101 mm

重量

TBD

安规认证

冲击测试

Operation shock test: Half Sine Wave 15G, 11ms, 3 Shock Per Axis

抗振动测试

Operation Vibration test: MIL-STD-810G 514.6C-2, Figure 514.6C-2

认证

CE, FCC class A, ROHS

Construction

IP67/ IP69K enclosure

装箱单

· 1 ECX700-ADP system unit
· 1 COMBO cable (for COM & CANBUS)
· 2 LAN cable
· 2 Wi-Fi antenna
· 2 LTE antenna
· 6 Dust cover (for antenna connector)
· 1 DC input cable

ECX700-ADP｜Intel®｜工业级系统｜友通资讯 DFI

ECX700-ADP 产品概要

Intel® Alder Lake-P Processor i5-1245UE/ i7-1265UE

Intel® Iris® Xe Graphic Performance

Extreme Ruggedized design to IEC 60068-2-64 & -20 ~ 70°C wide temperature

Rich I/O help integrators meet the demand for various applications

To fulfill wireless transmission, an external SIM slot reduces the difficulties to change SIMs, and the high gain antenna ensures the quality of the signal

Various applications: Industrial automation, Outdoor application

Waterproof & Dustproof design conforming to IP67

ECX700-ADP Feature

宽温: -20~70°C

宽压: 9~36V DC-in

无风扇设计

HDMI

强固型设计

IP67

ECX700-ADP 认证书

RoHS 认证

CE 认证

FCC 认证

ECX700-ADP 嵌入式系统解决方案采用：

ADP253

ECX700-ADP 相关标签

12th Gen Intel® Core™ 处理器

Windows 10

9~36V DC-in

IP69K

M.2

IP67

IoT

Windows 11

Intel

CAN-Bus

无风扇设计

Windows

Linux

HDMI

RoHS认证

CE认证

FCC认证

ECX700-ADP 相关资源

ECX700-ADP 相关产品

ECX700-AL

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