Name: ECX700-ADP
Brand: DFI

US Store

ECX700-ADP

產品概要

首頁工業級系統強固型嵌入式系統 ECX700-ADP

Intel® Alder Lake-P Processor i5-1245UE/ i7-1265UE

Intel® Iris® Xe Graphic Performance

Extreme Ruggedized design to IEC 60068-2-64 & -20 ~ 70°C wide temperature

Rich I/O help integrators meet the demand for various applications

To fulfill wireless transmission, an external SIM slot reduces the difficulties to change SIMs, and the high gain antenna ensures the quality of the signal

Various applications: Industrial automation, Outdoor application

Waterproof & Dustproof design conforming to IP67

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ECX700-ADP 嵌入式系統解決方案採用：

ADP253

4" SBC, 12th Gen Intel® Core™ Processors, On-board...

系統

處理器

12th Gen Intel® Core™ Processors, BGA 1744 (Alder Lake-P, 15W)
Intel® Core™ i7-1265UE Processor, 10C12T, 12M Cache, 1.7GHz (4.7GHz)
Intel® Core™ i5-1245UE Processor, 10C12T, 12M Cache, 1.5GHz (4.4GHz)

記憶體

8GB On-board memory & one SO-DIMM DDR4 up to 32GB
Dual Channel DDR4 3200MHz

BIOS

AMI SPI 256Mbit

顯示

控制器

Intel® Iris® Xe Graphics eligible

特性

OpenGL 4.2, Direct X 11.1, OpenCL 1.2, OGL ES 3.0
HW Decode: H.264, MPEG2, VC1, VP8, H.265, MPEG4, MVC, VP9, WMV9, JPEG/MJPEG
HW Encode: H.264, MPEG4, VP8, H.265, MVC

顯示器

1 x HDMI
HDMI: resolution up to 3840x2160@30Hz

儲存

M.2 SSD (M Key)

256GB Available(128GB/512GB by project support)

擴充

介面

1 x M.2 3042/3052 B key (PCIe x1 & USB3.0/2.0)(for LTE or 5G module)
1 x M.2 2230 E Key (PCIe x1 & USB2.0)(for Wi-Fi module)

乙太網路

控制器

2 x Intel® i225IT (10/100/1000Mbps)

LED

指示燈

1 x Power Status LED

側面輸入/輸出

顯示器

1 x HDMI

SIM

1 x SIM card slot

USB

2 x USB 3.2

上板輸入/輸出

天線孔

6 x Antenna (2 x WiFi, 4 x LTE)

底板輸入/輸出

乙太網路

2 x GbE

USB

2 x USB 3.2

集合連接器

2 x RS232 and 2 x Can bus protocol

電源

1 x 9~36V DC-IN

Vent

1 x Vent

監視計時器

輸出與時間間隔

System Reset, Programmable via Software from 1 to 255 Seconds

電源

類型

DC-in 9~36V

連接埠

M12 D-code

支援作業系統

微軟

Windows 10 IoT Enterprise 64-bit
Windows 11 IoT Enterprise LTSC 2024

Linux

環境指標

運作溫度

-20 to 70°C

儲存溫度

-40 to 85°C

相對溼度

5 to 95% RH (non-condensing)

機械結構

安裝方式

Wall mount

尺寸 (寬 x 高 x 深)

239.24 x 194 x 101 mm

重量

TBD

安規認證

衝擊測試

Operation shock test: Half Sine Wave 15G, 11ms, 3 Shock Per Axis

抗振動測試

Operation Vibration test: MIL-STD-810G 514.6C-2, Figure 514.6C-2

認證

CE, FCC class A, ROHS

Construction

IP67/ IP69K enclosure

裝箱單

· 1 ECX700-ADP system unit
· 1 COMBO cable (for COM & CANBUS)
· 2 LAN cable
· 2 Wi-Fi antenna
· 2 LTE antenna
· 6 Dust cover (for antenna connector)
· 1 DC input cable

Country of Origin

台灣

ECX700-ADP｜Intel®｜工業級系統｜友通資訊 DFI

ECX700-ADP 產品概要

Intel® Alder Lake-P Processor i5-1245UE/ i7-1265UE

Intel® Iris® Xe Graphic Performance

Extreme Ruggedized design to IEC 60068-2-64 & -20 ~ 70°C wide temperature

Rich I/O help integrators meet the demand for various applications

To fulfill wireless transmission, an external SIM slot reduces the difficulties to change SIMs, and the high gain antenna ensures the quality of the signal

Various applications: Industrial automation, Outdoor application

Waterproof & Dustproof design conforming to IP67

ECX700-ADP Feature

寬溫: -20~70°C

寬壓: 9~36V DC-in

無風扇設計

HDMI

強固型設計

IP67

ECX700-ADP 認證書

RoHS 認證

CE 認證

FCC 認證

ECX700-ADP 嵌入式系統解決方案採用：

ADP253

ECX700-ADP 相關標籤

12th Gen Intel® Core™ 處理器

Windows 10

9~36V DC-in

IP69K

M.2

IP67

IoT

Windows 11

Intel

CAN-Bus

無風扇設計

Windows

Linux

HDMI

RoHS認證

CE認證

FCC認證

ECX700-ADP 相關資源

ECX700-ADP 相關產品

ECX700-AL

與友通合作

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