Name: KD632-Q170
Brand: DFI

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KD632-Q170

Overview

Home Industrial Motherboards ATX KD632-Q170

6th/7th Gen Intel® Core™ with Intel® Q170

4 DDR4 Non-ECC U-DIMM up to 64GB

3 independent displays: VGA + DVI-I (DVI-D signal) + DP++

Multiple expansion: 2 PCIe x16 (1 x16 or 2 x8 signal), 3 PCIe x4, 2 PCI, 1 M.2 M key, 1 Mini PCIe

Rich I/O: 2 Intel GbE, 6 COM, 6 USB 3.1 Gen1, 7 USB 2.0

10-Year CPU Life Cycle Support Until Q2' 25 (Based on Intel IOTG Roadmap)

Status : Launched BUY ONLINE (US)

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KD632-Q170 Related Tags

#Intel#Mini PCIe#4K2K Display#PCIe x16#Windows#Linux#DVI-I#DVI-D#VGA#DP#Multiple Expansion#DDR4#RoHS Certification#CE Certification#FCC Certification#Legacy ISA/PCI Expansion Port

System

Processor

6th/7th Generation Intel® Core™ /Pentium®/Celeron® LGA 1151 Socket Processors with TDP up to 95W

Chipset

Intel® Q170 Chipset

Memory

Four 288-pin Non-ECC U-DIMM up to 64GB
Dual Channel DDR4 2133/2400MHz

BIOS

Insyde SPI 128Mbit

Graphics

Controller

Intel® HD Gen 9 Graphics

Feature

OpenGL 5.0, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9

Display

1 x VGA
1 x DVI-I (DVI-D signal)
1 x DP++
VGA: resolution up to 1920x1200 @ 60Hz
DVI-D: resolution up to 1920x1200 @ 60Hz
DP++: resolution up to 4096x2160 @ 60Hz

Triple Displays

VGA + DVI-I (DVI-D signal) + DP++

Expansion

Interface

2 x PCIe x16 (1 x16 or 2 x8 signal) (Gen 3)
3 x PCIe x4 (Gen 3)
2 x PCI
1 x M.2 2260/2280 M key (SATA3.0/PCIe Gen3 x 2 NVMe)
1 x Mini PCIe (PCIe/mSATA/USB 2.0)

Audio

Audio Codec

Realtek ALC888S-VD2-GR

Ethernet

Controller

1 x Intel® I210AT PCIe (10/100/1000Mbps)
1 x Intel® I219LM PCIe with iAMT11.0 (10/100/1000Mbps) (only Core i7/i5 supports iAMT)

Rear I/O

Ethernet

2 x GbE (RJ-45)

Serial

1 x RS-232/422/485 (RS-232 w/ power) (DB-9)

USB

4 x USB 3.1 Gen1
2 x USB 2.0

PS/2

1 x PS/2 (mini-DIN-6)

Display

1 x VGA
1 x DVI-I (DVI-D signal)
1 x DP++

Audio

1 x Line-out, 1 x Mic-in, 1 x Line-in (opt., MOQ required)

Internal I/O

Serial

1 x RS-232/422/485 (RS-232 w/ power) (2.54mm pitch)
4 x RS-232 (2.54mm pitch)

USB

2 x USB 3.1 Gen1
4 x USB 2.0 + 1 x Vertical USB 2.0 (type A)

Audio

1 x Front Audio Header
1 x S/PDIF

SATA

5 x SATA 3.0 (up to 6Gb/s)
(1 SATA shared with mini PCIe (SATA), default at mini PCIe/2 SATA shared with M.2, default at M.2)
RAID 0/1/5/10

DIO

1 x 8-bit DIO

LPC

1 x LPC (supports LPC EXT-RS232/RS485 module)

SMBus

1 x SMBus

Watchdog Timer

Output & Interval

System Reset, Programmable via Software from 1 to 255 Seconds

Security

TPM

Infi neon TPM1.2/2.0 (opt., MOQ required)

Power

Type

ATX

Connector

8-pin ATX 12V power
24-pin ATX power

Consumption

Idle: i7-7700 65W: 12V @ 0.29A (3.48W), 5V @ 0.47A (2.35W), 3.3V @ 0.32A 1.056W)
Max: i7-7700 65W: 12V @ 7.86A (94.32W), 5V @ 1.43A (7.15W), 3.3V @ 0.36A (1.188W)

RTC Battery

CR2032 Coin Cell

OS Support

Windows 7 32/64-bit
Window 8.1 64-bit
Windows 10 64-bit
Linux
Note: 7th Gen CPU SKU ONLY support Windows 10 64-bit & Linux.

Environment

Temperature

Operating: 0 to 60°C
Storage: -30 to 60°C with RTC Battery; -40 to 85°C without RTC Battery

Humidity

Operating: 5 to 90% RH
Storage: 5 to 90% RH

MTBF

537,588 hrs @ 25°C; 298,813 hrs @ 45°C; 184,762 hrs @ 60°C
Calculation model: Telcordia Issue 4
Environment: GB, GC – Ground Benign, Controlled

Mechanism

Dimensions

ATX Form Factor
305mm (12") x 244mm (9.6")

Height

PCB: 1.6mm
Top Side: 37.35mm
Bottom Side: 4.4mm

Standards and Certifications

Certifications

CE, FCC Class B, RoHS

Packing List

1 KD632-Q170 motherboard
1 COM port cables (Length: 400mm, 2 x COM ports): A81-015026-023G
1 Serial ATA data cable (Length: 500mm): 332-553001-005G
1 I/O shield: A49-KD6000-000G
: 643-KD6321-000G
1 M.2 standoff: A33-725019-090G
1 M.2 screw: A32-112016-041G

Country of Origin

Taiwan

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Working with DFI

DFI’s Customization Services (DCS) comes with full support and industry expertise from a dedicated team to provide you exclusive services in design, production, warranty, repairs, and life cycle management. In order to make the project as easy as possible for you, DFI will closely work with you to learn your design requirements and offer real-time technical support as you develop the solution to reduce your development cost and effort.

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KD632-Q170｜Intel®｜Industrial Motherboards｜DFI

KD632-Q170 Overview

6th/7th Gen Intel® Core™ with Intel® Q170

4 DDR4 Non-ECC U-DIMM up to 64GB

3 independent displays: VGA + DVI-I (DVI-D signal) + DP++

Multiple expansion: 2 PCIe x16 (1 x16 or 2 x8 signal), 3 PCIe x4, 2 PCI, 1 M.2 M key, 1 Mini PCIe

Rich I/O: 2 Intel GbE, 6 COM, 6 USB 3.1 Gen1, 7 USB 2.0

10-Year CPU Life Cycle Support Until Q2' 25 (Based on Intel IOTG Roadmap)

KD632-Q170 Feature

COM ESD Protection: Air Gap ±15kv

4K2K Display

Windows

Multiple Expansion

DDR4

KD632-Q170 Certifications

RoHS Certification

CE Certification

FCC Certification

KD632-Q170 Related Tags

Intel

Mini PCIe

4K2K Display

PCIe x16

Windows

Linux

DVI-I

DVI-D

VGA

DP

Multiple Expansion

DDR4

RoHS Certification

CE Certification

FCC Certification

Legacy ISA/PCI Expansion Port

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