Name: HR900-B
Brand: DFI

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HR900-B

Overview

Home System-On-Modules COM Express Basic HR900-B

3rd/2nd Gen Intel® Core™, Intel® QM67 Chipset

Rich I/O: 1 Intel GbE, 8 USB 2.0

Multiple expansion: 1 PCIe x16, 4 SATA, 1 LPC, 1 IDE, 1 SMBus

1 VGA, 1 LVDS, 2 DDI (HDMI/DP/SDVO)

Dual channel DDR3 1600MHz SODIMM up to 16GB

7-Year CPU Life Cycle Support Until Q3' 18 (Based on Intel IOTG Roadmap)

Status : EOL

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HR900-B Related Tags

#Intel#1G Ethernet#PCIe x16#Windows#HDMI#VGA#Multiple Expansion#DDR3#RoHS Certification#UL Certification#CE Certification#FCC Certification#UL-US Certification

System

Processor

Socket G2 988B for:
- 3rd Generation Intel® Core™ processors (22nm process technology)
Intel® Core™ i7-3610QE (6M Cache, up to 3.3 GHz); 45W
Intel® Core™ i5-3610ME (3M Cache, up to 3.3 GHz); 35W
Intel® Core™ i3-3120ME (3M Cache, 2.4 GHz); 35W
- 2nd Generation Intel® Core™ processors (32nm process technology)
Intel® Core™ i7-2710QE (6M Cache, up to 3.0 GHz); 45W
Intel® Core™ i5-2510E (3M Cache, up to 3.1 GHz); 35W
Intel® Core™ i3-2330E (3M Cache, 2.2 GHz); 35W
Intel® Celeron® B810 (2M Cache, 1.6 GHz); 35W

Chipset

Intel® QM67 Chipset

Memory

Two 204-pin SODIMM up to 16GB Dual Channel DDR3 1600MHz

BIOS

UEFI 64Mbit SPI

Graphics

Controller

Intel® HD Graphics 4000 (3rd generation processors)
Intel® HD Graphics 3000 (2nd generation processors)
Intel® HD Graphics (Intel® Celeron™ processors)

Feature

DirectX Video Acceleration (DXVA) for accelerating video processing
- Full AVC/VC1/MPEG2 HW Decode
Supports DirectX 11/10.1/10/9 and OpenGL 3.0 (3rd generation processors)
Supports DirectX 10.1/10/9 and OpenGL 3.0 (2nd generation processors)

Display

1 x VGA
1 x LVDS
2 x DDI(HDMI/DP/SDVO)
VGA: resolution up to 2048x1536 @ 75Hz
LVDS: dual channel 36/48-bit, resolution up to 1920x1200 @ 60Hz
HDMI/DP: resolution up to 1920x1200 @ 60Hz

Expansion

Interface

1 PCIe x16
5 PCIe x1
4 PCI
1 x LPC
1 x IDE
1 x SMBus

Audio

Interface

HD Audio

Ethernet

Controller

1 x Intel® 82579LM (10/100/1000Mbps)

I/O

USB

8 x USB 2.0

SATA

2 x SATA 3.0 (up to 6Gb/s)
2 x SATA 2.0 (up to 3Gb/s)

DIO

1 x 8-bit DIO

Watchdog Timer

Output & Interval

System Reset, Programmable via Software from 1 to 255 Seconds

Power

Type

4.75V~20V, 5VSB, VCC_RTC (ATX mode)
4.75V~20V, VCC_RTC (AT mode)

Consumption

54.70 W with i7-2710QE at 2.10GHz and 2x 4GB DDR3 SODIMM

OS Support

Windows XP Professional x86 & SP3 (32-bit)
Windows XP Professional x64 & SP2 (64-bit)
Windows 7 Ultimate x86 & SP1 (32-bit)
Windows 7 Ultimate x64 & SP1 (64-bit)
Windows 8 Enterprise x86 (32-bit)
Windows 8 Enterprise x64 (64-bit)

Environment

Temperature

Operating: 0 to 60°C
Storage: -20 to 85°C

Humidity

Operating: 10 to 90% RH
Storage: 10 to 90% RH

MTBF

TBD

Mechanism

Dimensions

COM Express® Basic 95mm (3.74") x 125mm (4.9")

Compliance

PICMG COM Express® R1.0, Type 2

Standards and Certifications

Certifications

CE, FCC Class B, RoHS, UL

Packing List

1 HR900-B board
1 Drivers/utilities disk

Country of Origin

Taiwan

Related Materials

News
DFI Announces COM Express Module HR900-B Supporting 2nd Generation Intel Core i7-2710QE Processor
DFI today launches the COM Express basic type 2 form factor HR900-B mobile platform offering higher ...
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HR900-B｜Intel®｜System-On-Modules｜DFI

HR900-B Overview

3rd/2nd Gen Intel® Core™, Intel® QM67 Chipset

Rich I/O: 1 Intel GbE, 8 USB 2.0

Multiple expansion: 1 PCIe x16, 4 SATA, 1 LPC, 1 IDE, 1 SMBus

1 VGA, 1 LVDS, 2 DDI (HDMI/DP/SDVO)

Dual channel DDR3 1600MHz SODIMM up to 16GB

7-Year CPU Life Cycle Support Until Q3' 18 (Based on Intel IOTG Roadmap)

HR900-B Feature

1G Ethernet

VGA

Multiple Expansion

15 Years CPU Life Cycle Support

DDR3